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*注:以下数据均在25℃,50%湿度的环境下测试
Model Product name Mix ratio Color Shore
(Shore)
Operational time
(min)
Tack free time(min) Cutting time(H) Deglue method Characteristicss
DL2223 Silicon Rod Glue 1:1 white/bule 86~87D 10~15 45~60 4 55~75℃ hot water 10mins Appropriate operation time,fast deglue time; Do not pollute the silicon wafer
DL7221 Silicon Rod Glue One component Light yellow liquid / / 5 2~4 55~75℃ hot water 10mins Excellent adhesion; Easy to operate; Fast-cure at room temperature
DL7222 Silicon Rod Glue One component Light yellow liquid / / 1 2~4 55~75℃ hot water 10mins Special for diamond wire cutting; Deglue by warm water; Short deglue time; Stable performance
DL2228 Silicon Rod Glue 1:1 white/green 89 8~12 30~40 2~4 55~75℃ hot water 10mins Special for diamond wire cutting;Deglue by warm water and short time;Stable performance
DL2227 Silicon Rod Glue 1:1 white/pink 85~87D 15~20 40~45 2~4 Mix lactate with water heat to 55~75℃15mins Fast-cure at room temperature;Excellent adhesion; Easy to deglue in warm water; Tg high temperature,suitable for diamond wire cutting
DL2226 Silicon Rod Glue 1:1 white/green 84~87D 5~8 25~30 4 55~75℃ hot water 10mins High bonding strength,short cure time;Deglue by warm water; Stable performance

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